INTERNATIONAL THERMAL CONDUCTIVITY CONFERENCE (ITCC)
AND THE
INTERNATIONAL THERMAL EXPANSION SYMPOSIUM (ITES)

MAY 22-26, 2016 • Utah State University, Logan, UT

logo Welcome to the official web site of the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES). These two conferences are held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics. The proceedings are published in hard cover format following the conference and a rigorous peer review.






NOW ACCEPTING PROPOSALS TO PRESENT!

We are pleased to announce we are now accepting papers to present at the:
33rd International Thermal Conductivity Conference and 21st International Thermal Expansion Symposium!

All who are interested are encouraged to submit a proposal!


Papers accepted and presented at the Conference and Symposium will be published after a rigorous peer review. Visit our PUBLICATION tab on the website for more information on how to submit your paper for publication. If you have any questions please contact Robbie Gerber.

Each abstract submitted will require:

  • Abstract Title
  • Type (Poster or Oral presentation)
  • 250 word description

Presenter Information:

  • First and Last Name
  • Email address for notifications
  • Person type – POC (Point of Contact) Primary Presenter, Author, & Co-Author (Mark all that apply)
  • Main Phone
  • Employment Title
  • Affiliation

Deadline for papers is March 4, 2016.

Final papers for publication will be due shortly after the conference in May..

After your paper has been accepted please make sure you register for the conference.

After your abstract has been submitted there will be a review process. You will be notified by email of your acceptance.






EARLY BIRD REGISTATION HAS BEEN EXTENDED TO March 18, 2016 at 11:59PM MST.

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