The 33rd ITCC INTERNATIONAL THERMAL CONDUCTIVITY CONFERENCE (ITCC) and
The 21ST INTERNATIONAL THERMAL EXPANSION SYMPOSIUM (ITES)

Monday, May 15 - Thursday, May 18, 2017

Hosted by Utah State University and the College of Engineering
Conference Chair – Heng Ban, PhD

Utah State University, Logan, UT

Welcome to the official web site of the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES). These two conferences are held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics. The proceedings are published in hard cover format following the conference and a rigorous peer review

~What's New~


June 3, 2016 – ‘Submit an Abstract’ site is now open
*2015 November - Website Launched



~Important Dates~


  1. Abstract Submission Opens June 3, 2016
  2. Early-bird Registration Opens July 1, 2016
  3. Abstract Submission Deadline January 20, 2017
  4. Notification of Acceptance February 4-11, 2017
  5. Early-bird Registration Deadline February 20, 2017
  6. Regular Registration Deadline April 28, 2017


~Venue~


uicc.usu.edu











Contact Us